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May 27, 2014 | Thermal simulation of complex circuits a success

Docea Power, which has a joint lab with CEA LIST, recently demonstrated the precision of its thermal simulation modelling software for complex integrated circuits at the 2014 Design Automation Conference in the United States.

Docea Power used the Sthorm 64-processor architecture, which is used to run a people-detection and counting application, for the demonstration. Docea Power compared a Sthorm-based thermal behavior simulation leveraging its own software with actual temperature measurements taken on a chip in operation. The margin of error was under 15%, good enough to validate a proposed thermal management strategy.

The demo marks a major step forward for Docea Power. The company is now that much closer to developing software capable of assessing the thermal behavior of complex circuits in the very early design phases rather than after the fact. The early-stage insights will minimize the impact of heat-related phenomena on performance and reliability and help reduce the costs associated with over-sizing chip packaging, all without affecting time to market. Other uses for the software are already under consideration, like studying the effects of heat-related phenomena on aging.

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